Huawei plans to launch a 56Mbps High Speed Packet Access Plus (HSPA+) solution by 2010.
The wireless mobile broadband system is designed to feature multi-carrier and multiple-input multiple-output (MIMO) technologies and will be made available through a software upgrade.
The company claims this next generation will double the speed currently available as well as offering big savings in the long term.
Wan Biao, president of wireless at Huawei, said in a statement: "Advances in mobile broadband, particularly record breaking data speeds and capacity of HSPA networks, have had a profound impact on the telecom industry and demonstrate the enormous potential of UMTS/HSPA."
He added: "This 56Mbps HSPA+ solution will enable operators to maintain their industry leading positions and provide consumers with an evermore attractive mobile broadband experience."
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