MediaTek has unveiled its first mmWave chipset, Dimensity 1050. The system on chip (SoC) pools mmWave 5G with sub-6GHz to make switching between network bands fluid and seamless.
Dimensity 1050 will be capable of delivering up to 53 percent faster speeds and greater reach to smartphones compared to LTE + mmWave aggregation alone, according to MediaTek.
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Hosting two Arm Cortex-A78 CPUs and the latest Arm Mali-G610 graphics engine, Dimensity 1050 is set to offer end-to-end 5G smartphone connectivity. MediaTek also announced two additional SoCs, Dimensity 930 and Helio G99, furthering its 5G and gaming chipset line.
With 2CC-CA, Dimensity 930 will enable 5G smartphones to download data faster and stay connected regardless of location, while the new Helio G99 is optimized to support mobile gaming experiences on 4G/LTE with greater throughput and higher power efficiency than Helio G96.
In a separate statement, the Taiwanese semiconductor company announced its Filogic 880 and Filogic 380 Wi-Fi 7 platform solutions aimed at high bandwidth applications.
Filogic 880 comes with a 6nm Wi-Fi 7 access point solution with support for key Wi-Fi 7 technologies, including 4096-QAM, 320MHz, MRU, and MLO. Built-in networking crypto engine, EIP-197, allows for superior IPSec, SSL/TLS, DTLS (CAPWAP), SRTP and MACsec performance. Mediatek’s Filogic 380 is a stand-alone, single-chip 6nm Wi-Fi 7 solution that offers support for the latest Bluetooth 5.3 with LE Audio.
The firm will demonstrate the industry-first Wi-Fi 7 platform solutions, which can be used both in access point and client environments, at Computex 2022, taking place in Taipei from May 24 to May 27.
As for mmWave chipsets, Dimensity 930-powered smartphones are scheduled for the second quarter of 2022. Dimensity 1050 and Helio G99 will make their appearance in the third quarter of the current fiscal year.
"The Dimensity 1050, and its combination of sub-6GHz and mmWave technologies, will deliver end-to-end 5G experiences, uninterrupted connectivity and superior power efficiency to meet everyday user demands," said CH Chen, deputy general manager of wireless communications at MediaTek.
"With faster, more reliable connections, and advanced camera technology this chip delivers powerful features to help device makes to differentiate their smartphone product lines," added Chen.
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